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News

December 15,
2015
We will exhibit at SEMICON Japan 2015.

Date:

 December 17 (Thu.), 2015
 13:30 - 17:00

Description:
 Sicoxs Sample Bonding Wafer

Location:
 Tokyo Big Sight, Tokyo, JAPAN
 Booth No. 3434(Booth of Mizuho Bank Ltd.), East Hall 3

→URL

→Floor Map

September 22,
2014
The presentation at the Poster Session (MO-P-50)
in ECSCRM2014


→ press release
August 22, 2014
The artcle about SICOXS was posted on a website,
"Everging tech from Japan" of Semiconportal


→ Pilot line for low-cost SiC wafer to launch in 2016
June 25, 2014
SICOXS CORPORATION’s application was accepted as a new project in “The 3rd Project of Industry and Academia Collaborative Development Works” Of JST (Japan Science and Technology Agency)

→ press release
March 18, 2014
SICOXS moving to new office
and change phone number

→Access

October 2, 2013
The development technology is based on the result
presented at ICSCRM 2013


→ press release
July 25, 2013
opened SICOXS Site

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SICOXS CORPORATION

Kandamatsunagacho23, Chiyoda-ku,
Tokyo 101-0023, Japan


TEL : +81-3-3525-8804
FAX : +81-3-6206-4816